yourfanat wrote: I am using another tool for Oracle developers - dbForge Studio for Oracle. This IDE has lots of usefull features, among them: oracle designer, code competion and formatter, query builder, debugger, profiler, erxport/import, reports and many others. The latest version supports Oracle 12C. More information here.
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FCI and 3M Announce Second-source Agreement for HPCE and HP2 Power Products

FCI, a leading supplier of power products and interconnect systems, and 3M have entered into a second-source agreement covering the High Power Card Edge (HPCE®) and HP2 power product families.

“We are excited about this opportunity,” said Dong Yu, global power portfolio director at FCI. “Working with 3M will drive the standard for low-profile, high-efficiency power connectors and cable assemblies. HPCE already has great traction in the market and HP2 will further extend the family with innovative, two-piece solutions for board-to-board and cable-to-board applications.”

“3M is extremely pleased to work with FCI by providing the industry with a second source of FCI’s innovative HPCE and HP2 power connectors and cable assemblies,” said David Schneider, global business manager for interconnect, 3M Electronic Solutions Division. “FCI’s expertise in power product design and 3M’s expertise in connector technology and material science is a good match to offer a standard, dual-sourced power solution.”

The HPCE connector is a next-generation power card edge connector for demanding applications requiring high linear current density and low power loss. HPCE offers a low profile height (2.8 mm for straddle mount and 7.5 mm for right angle) and is based on very cost-effective and highly reliable stamped-and-formed power contact technology similar to other power solutions from FCI.

The HPCE connector incorporates an innovative power contact and housing design that permits a more compact and lower profile package for demanding AC and DC power supply and/or add-in card applications. HPCE’s low profile height (for maximized airflow), significantly increased linear current density and low contact resistance characteristics are ideal for next generation 1U/2U servers, storage enclosures, telecommunications equipment and datacom/networking equipment.

The innovative HPCE cable-to-card edge is available with the same desirable features as the standard HPCE board mount product but is focused on power distribution applications via cabling. It includes high power (10 – 14 AWG wire) and low power (14 – 16 AWG wire) contact options as well as integrated signal contacts (22 – 26 AWG wire). The modular tooling approach maximizes flexibility to meet a wide range of power distribution requirements including bus bar attachment. The integrated latching option makes it ideal for high shock-and-vibration environments.

The HP2 product is similar to HPCE but utilizes a two-piece design (header-to-receptacle connectors/cable assemblies). Integrated guide features make it ideal for blindmate applications where system guidance is not readily available. The HP2 product is available in board-to-board and cable-to-board configurations and includes power contacts for power distribution and signal contacts for power control.

3M anticipates having the connectors available in early 2013.

About 3M Electronic Solution Division – Interconnect
3M Electronic Solutions Division’s Interconnect business offers a variety of innovative connectors, cables and cable assemblies, embedded capacitance materials and Textool brand test and burn-in sockets for component engineers and designers in the electronics industry. For more information about 3M’s interconnect solutions, visit: Information about 3M Company is available online.

About FCI
With operations in 30 countries, FCI is a leading manufacturer of connectors. Our 14,000 employees are committed to providing customers with high-quality, innovative products for a wide range of consumer and industrial applications. For more information:

3M and Textool are trademarks of 3M Company. HPCE® and HP2® are registered trademarks of FCI. All other trademarks, names and brands listed herein are property of their respective owners and/or companies.

About Business Wire
Copyright © 2009 Business Wire. All rights reserved. Republication or redistribution of Business Wire content is expressly prohibited without the prior written consent of Business Wire. Business Wire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.

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