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Semiconductor Market Updates: Networking Equipment Market Slows in Second Half of 2012, Intel Dominates Mid-End Wafers, 3DIC Material Market to Reach $2B in 2017

FARMINGTON, Conn., Nov. 19, 2012 /PRNewswire-iReach/ -- In the networking IC market, growth continues to be driven by infrastructure markets supporting the growing volume of data and users on the Internet. Meanwhile, according to new research from Yole Developpement, the equipment and materials business will quadruple over the next five years in the 3D TSV, FO WLP, 3D WLP, WLCSP, 2.5D interposers and flip-chip wafer segments.

(Photo: http://photos.prnewswire.com/prnh/20121119/CG16190)

Global Information Inc (GII) highlights new market research from our premium partner publishers that will benefit executives involved in the global market for semiconductor materials and manufacturing.

2012 Networking Market Tracker

The overall networking equipment market has slowed in the second half of 2012 with many customers decelerating and reducing spending on hardware. Most of the large equipment OEMs are predicting that fourth quarter revenues will remain flat sequentially from the third quarter, due to exposure to Europe where service providers have cut spending and increasing competition from lower cost domestic equipment makers in China.

The networking IC market consists of products that are used in network equipment including network switches, routers, modems, adapters, cards, line cards, cable infrastructure, DSLAM, and other central office equipment. This market is driven by continued high growth in the infrastructure markets supporting the growing volume of data and users on the Internet.

Capital expenditures for data centers are expected to be up double digits this year, so next year there could be a slowdown. However, this market continues to advance at a pace not seen in other traditional segments. Some OEM customers that serve this market include Cisco Systems, F5 Networks, Juniper Networks, Hewlett Packard, and Huawei. Cisco has the lions share, but the other network equipment providers are steadily gaining momentum in the market.

An Executive Summary for this report and free sample pages from the full document are available at http://www.giiresearch.com/report/data237351-2012-networking-market-tracker.html

Equipment & Materials for 3DIC & Wafer-Level-Packaging

The global material market is expected to grow from approximately $590 million this year to over $2 billion by 2017 at a compound annual growth rate of 24%. Growth in the global market for 3DIC and wafer-level-packaging will be driven mainly by the expansion of 2,5D interposers and 3D TSV& WLP platforms. However, Yole Developpement forecasts a a slight decrease  in 2012 due to the fact that high-volume production in 3D TSV, FO WLP, and 3D WLP has not yet begun.

This report includes an Excel database with detailed activity of over 375 small, medium and large equipment and material suppliers ranging from front-end, back-end assembly, PCB, LCD, and solar divisions.

An Executive Summary for this report and free sample pages from the full document are available at http://www.giiresearch.com/report/yd194054-equipment-materials-3dic-wafer-level-packaging.html

Wafer Packaging Fabs Database 2012

Stay informed on global wafer-scale packaging activity of 275 middle-end factories with this new database from Yole Developpement.  This unique tool provides a global overview of "who is doing what" in this emerging ecosystem. The database provide details concerning each fab location by fab function, customers, JV, capacities by wafer size, and more.

Major companies cited in the database include: Amkor, Analog Devices, ASE, ASTRI, Avago, Bosch, BEA-LETI, China WLCSP, ChipBond, ChipMOS. EPCOS-TDK, Epson Electronics, Fairchild, Flip Chip international, Flip Chip Millennium, Fraunhofer, Freescale, Fujikura, Fujitsu Integrated Microtechnology, Global

Foundries, IBM, IMEC, Infineon, INTEL, ITRI, JCET, Maxim IC, NANIUM, NEPES, NXP, OptoPAC, PTI, Renesas, Rohm, Samsung, SMIC, SK Hynix, Sony, SPIL, STATS ChipPAC, STMicroelectronics, Teramikros, Texas Instrument, Tezzaron, Toshiba, TriQuint, TSMC, UMC Global, and Xintec.

An Executive Summary for this report and free sample pages from the full document are available at http://www.giiresearch.com/report/yd206538-wafer-packaging-fab-database.html

About Global Information Inc. Global Information (GII) (http://www.giiresearch.com) is an information service company partnering with over 300 research companies around the world. Global Information has been in the business of distributing technical and market research for more than 25 years. Expanded from its original headquarters in Japan, Global Information now has offices in Korea, Taiwan, Singapore, Europe and the United States.

Media Contact:

Jeremy Palaia Global Information, Inc., 1-860-674-8796, Press@gii.co.jp

News distributed by PR Newswire iReach: https://ireach.prnewswire.com

SOURCE Global Information, Inc.

About PR Newswire
Copyright © 2007 PR Newswire. All rights reserved. Republication or redistribution of PRNewswire content is expressly prohibited without the prior written consent of PRNewswire. PRNewswire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.

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