yourfanat wrote: I am using another tool for Oracle developers - dbForge Studio for Oracle. This IDE has lots of usefull features, among them: oracle designer, code competion and formatter, query builder, debugger, profiler, erxport/import, reports and many others. The latest version supports Oracle 12C. More information here.
Cloud Expo on Google News

2008 West
Data Direct
SOA, WOA and Cloud Computing: The New Frontier for Data Services
Red Hat
The Opening of Virtualization
User Environment Management – The Third Layer of the Desktop
Cloud Computing for Business Agility
CMIS: A Multi-Vendor Proposal for a Service-Based Content Management Interoperability Standard
Freedom OSS
Practical SOA” Max Yankelevich
Architecting an Enterprise Service Router (ESR) – A Cost-Effective Way to Scale SOA Across the Enterprise
Return on Assests: Bringing Visibility to your SOA Strategy
Managing Hybrid Endpoint Environments
Game-Changing Technology for Enterprise Clouds and Applications
Click For 2008 West
Event Webcasts

2008 West
Get ‘Rich’ Quick: Rapid Prototyping for RIA with ZERO Server Code
Keynote Systems
Designing for and Managing Performance in the New Frontier of Rich Internet Applications
How Can AJAX Improve Homeland Security?
Beyond Widgets: What a RIA Platform Should Offer
REAs: Rich Enterprise Applications
Click For 2008 Event Webcasts
Research and Markets: Reverse Costing Report of the VGA Camera Module Supplied by ST Microelectronics

Research and Markets ( has announced the addition of the "STMicro Wafer-Level Camera - WLP CIS + Heptagon WL-Optic Reverse Costing" report to their offering.

System Plus Consulting is proud to publish the reverse costing report of the VGA Camera Module supplied by ST Microelectronics for the Nokia 2330 mobile phone. This camera module integrates an 2.2µm pixel CMOS Image Sensor (CIS) from STMicro. The CIS die is manufactured using a CMOS technology with a 0.18µm process. The CIS is Wafer-Level Packaged (WLP) using a TSV "via last" technology. The optical module comes from Heptagon and is manufactured with a wafer-level approach.

- Physical Analysis of the Camera and the CMOS Image Sensor

- Step by Step Reconstruction of the Process Flow

- Cost of Manufacturing and Estimation of Selling Price

This report provides complete teardown of the camera module with:

- Detailed photos

- Material analysis

- Schematic assembly description

- Manufacturing Process Flow

- In-depth economical analysis

- Manufacturing cost breakdown

- Selling price estimation

Key Topics Covered:



- Executive Summary

- Reverse Costing Methodology

Companies Profiles

- CMOS Image Sensors. Volume Shipments

- STMicroelectronics Profile

- Heptagon Profile

Nokia 2330 Teardown

Physical Analysis

- Camera Module Views & Dimensions

- Camera X-Ray

- Camera Module Disassembly

- CIS Views & Dimensions

- CIS Markings

- CIS Bonding

- CIS Microlenses

- CIS Pixels

- CIS Back view

- Camera Module Cross-section

- Package Cross-section

- Optical Module Cross-section

- CIS Packaging Cross-section

- CIS Cross-section

Manufacturing Process Flow

- CIS Process Flow

- CIS Wafer-level packaging Process Flow

- Description of the CIS Wafer Fabrication Unit

- WL-Optic Process Flow

- Description of the WL-Optic Wafer Fabrication Unit

Cost Analysis


- CIS Front-End Cost

- CIS Back-End 0 : 1st Probe Test & Optical Test

- CIS WLP Cost

- CIS WLP Cost per Process Steps

- CIS WLP : Equipment Cost per Family

- CIS WLP : Material Cost per Family

- CIS Die Cost

- WL-Optic Front-End Cost

- WL-Optic Cost per Process Steps

- WL-Optic : Equipment Cost per Family

- WL-Optic : Material Cost per Family

- WL-Optic : Test, dicing and assembly

- WL-Optic Price

- Back-End : Final Packaging & Test

- Camera Module Cost (CIS + WLO + Packaging)

Estimated Price Analysis Conclusion

For more information visit

About Business Wire
Copyright © 2009 Business Wire. All rights reserved. Republication or redistribution of Business Wire content is expressly prohibited without the prior written consent of Business Wire. Business Wire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.

Latest AJAXWorld RIA Stories
To Really Work for Enterprises, MultiCloud Adoption Requires Far Better and Inclusive Cloud Monitoring and Cost Management … But How? Overwhelmingly, even as enterprises have adopted cloud computing and are expanding to multi-cloud computing, IT leaders remain concerned about how...
Andi Mann, Chief Technology Advocate at Splunk, is an accomplished digital business executive with extensive global expertise as a strategist, technologist, innovator, marketer, and communicator. For over 30 years across five continents, he has built success with Fortune 500 corp...
Internet-of-Things discussions can end up either going down the consumer gadget rabbit hole or focused on the sort of data logging that industrial manufacturers have been doing forever. However, in fact, companies today are already using IoT data both to optimize their operationa...
DXWorldEXPO | CloudEXPO are the world's most influential, independent events where Cloud Computing was coined and where technology buyers and vendors meet to experience and discuss the big picture of Digital Transformation and all of the strategies, tactics, and tools they need t...
DXWorldEXPO LLC announced today that "Miami Blockchain Event by FinTechEXPO" has announced that its Call for Papers is now open. The two-day event will present 20 top Blockchain experts. All speaking inquiries which covers the following information can be submitted by email to in...
Subscribe to the World's Most Powerful Newsletters
Subscribe to Our Rss Feeds & Get Your SYS-CON News Live!
Click to Add our RSS Feeds to the Service of Your Choice:
Google Reader or Homepage Add to My Yahoo! Subscribe with Bloglines Subscribe in NewsGator Online
myFeedster Add to My AOL Subscribe in Rojo Add 'Hugg' to Newsburst from CNET Kinja Digest View Additional SYS-CON Feeds
Publish Your Article! Please send it to editorial(at)!

Advertise on this site! Contact advertising(at)! 201 802-3021

SYS-CON Featured Whitepapers