Comments
yourfanat wrote: I am using another tool for Oracle developers - dbForge Studio for Oracle. This IDE has lots of usefull features, among them: oracle designer, code competion and formatter, query builder, debugger, profiler, erxport/import, reports and many others. The latest version supports Oracle 12C. More information here.
Cloud Expo on Google News
SYS-CON.TV

2008 West
DIAMOND SPONSOR:
Data Direct
SOA, WOA and Cloud Computing: The New Frontier for Data Services
PLATINUM SPONSORS:
Red Hat
The Opening of Virtualization
GOLD SPONSORS:
Appsense
User Environment Management – The Third Layer of the Desktop
Cordys
Cloud Computing for Business Agility
EMC
CMIS: A Multi-Vendor Proposal for a Service-Based Content Management Interoperability Standard
Freedom OSS
Practical SOA” Max Yankelevich
Intel
Architecting an Enterprise Service Router (ESR) – A Cost-Effective Way to Scale SOA Across the Enterprise
Sensedia
Return on Assests: Bringing Visibility to your SOA Strategy
Symantec
Managing Hybrid Endpoint Environments
VMWare
Game-Changing Technology for Enterprise Clouds and Applications
Click For 2008 West
Event Webcasts

2008 West
PLATINUM SPONSORS:
Appcelerator
Get ‘Rich’ Quick: Rapid Prototyping for RIA with ZERO Server Code
Keynote Systems
Designing for and Managing Performance in the New Frontier of Rich Internet Applications
GOLD SPONSORS:
ICEsoft
How Can AJAX Improve Homeland Security?
Isomorphic
Beyond Widgets: What a RIA Platform Should Offer
Oracle
REAs: Rich Enterprise Applications
Click For 2008 Event Webcasts
Optomec to Present New Micro Dispense Process Using Aerosol Jet Printer for High Density 3D Packaging

Optomec announced today that Dr. Mike Renn, Optomec Advanced Applications Lab Director, will give a presentation titled "Aerosol Jet Printing of Conductive Epoxy for 3D Packaging" in the Advanced Materials track at the Pan Pacific Microelectronics Symposium in Hawaii. The conference will be held January 22-24 at the Makena Beach and Golf resort in Maui.

Dr. Renn will discuss how traditional dispensing technologies are typically limited to feature sizes above 100 microns and have limited 3D capability due to near or direct-surface contact with the substrate. Conductive adhesives for these systems typically contain large metallic flakes which lead to inconsistent conductivity in small features such as dots. The presentation will explain how a new, nanoparticle conductive adhesive, when dispensed with an Aerosol Jet Printer, demonstrated non-contact printing over 3D surfaces and into recesses such as through silicon vias (TSV). The conductive adhesive, manufactured by Resin Designs, is a high-solids, nanoparticle system with resistivity as low at 5 μW-cm at 150º C cure temperatures. The adhesive has superior thermal conductivity, adhesion, and elasticity, which are desirable for fabricating heterogeneous connections, such as between IC chips and circuit boards. The material can be Aerosol Jet dispensed with dot sizes down to 25 μm, which enables high-density die attach. Similarly, TSV filling has been demonstrated with via diameters down to 50 μm and depths of 300 μm. The high-solids formulation reduces the material shrinkage during curing resulting in a dense conductive plug.

Aerosol Jet printing has mainly been used for dispensing nanosilver inks for photovoltaics, printed circuits, and printed antenna. One major advantage of this system is that fine feature printing, down to 10 μm feature size, can be achieved with a surprisingly large standoff height (up to 10 mm). This capability allows for printing in recessed regions such as vias, over step edges such as SMT devices, and over non-planar substrates such as populated boards. In contrast to other jetting techniques, the ink droplets in the Aerosol Jet system do not actually interact with the surfaces of the nozzle. This feature results in greatly reduced frequency of clogging and less sensitivity to specific ink rheologies, such as viscosity, surface tension and solids loading. For more information on Aerosol Jet printing, click here.

The Pan Pacific Microelectronics Symposium promotes international technical interchange and provides a premier forum for networking among microelectronics professionals and business leaders throughout the world. Conference sessions include Failure Analysis Tools and Techniques, Strategic Directions, 3D Structures, Advanced Materials, Advanced Manufacturing Challenges, Trends, Roadmaps, and more. For details on the conference, go to http://www.smta.org/panpac/.

Optomec is a privately-held, rapidly growing supplier of Additive Manufacturing systems. These solutions utilize Optomec’s patented Aerosol Jet Printed Electronics technology and LENS Printed Metal technology to reduce costs and improve performance. Together, these unique 2D and 3D printing solutions work with the broadest spectrum of functional materials, ranging from electronic inks to structural metals and even biological matter. Optomec has more than 150 marquee customers around the world, targeting production applications in the Electronics, Energy, Life Sciences and Aerospace industries.

About Business Wire
Copyright © 2009 Business Wire. All rights reserved. Republication or redistribution of Business Wire content is expressly prohibited without the prior written consent of Business Wire. Business Wire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.

Latest AJAXWorld RIA Stories
One of the most appealing benefits of cloud deployment is the ease of use and the flexibility of adding or removing compute capacity. You can dynamically allocate resources based on the changing workloads, which give you the flexibility in managing your compute cost. AWS Auto Sc...
At the beginning of the book the authors say they created this book to be used in a classroom setting. I agree that it is a great book for the classroom, but I would also recommend it to anyone who wants to learn about the current Agile methodologies. It does what the title of th...
As an enterprise and software architect the one thing I hate most about my job is documentation, yet the importance of doing documentation on sizable projects is what I find myself preaching about the most. One reason I understand the importance of documentation is that I came f...
The premiere issue of the Internet of @ThingsExpo Newsletter contains highlights of the hottest sessions and speakers from Internet of @ThingsExpo, Call for Papers information, and sponsorship opportunities.
“At Cloud Expo in NYC last week I sat in on the Internet of Things power panel and then presented about how to monetize the Internet of Things. The room was packed, standing room only and I stuck around for a full 30 minutes afterwards answering questions before I had to tear mys...
Subscribe to the World's Most Powerful Newsletters
Subscribe to Our Rss Feeds & Get Your SYS-CON News Live!
Click to Add our RSS Feeds to the Service of Your Choice:
Google Reader or Homepage Add to My Yahoo! Subscribe with Bloglines Subscribe in NewsGator Online
myFeedster Add to My AOL Subscribe in Rojo Add 'Hugg' to Newsburst from CNET News.com Kinja Digest View Additional SYS-CON Feeds
Publish Your Article! Please send it to editorial(at)sys-con.com!

Advertise on this site! Contact advertising(at)sys-con.com! 201 802-3021


SYS-CON Featured Whitepapers
ADS BY GOOGLE